TOKYO, July 18 (Bernama-AsiaNet) -- Polyplastics Co., Ltd., a leading global supplier of engineering thermoplastics, is successfully utilizing computer-aided engineering (CAE) analysis to forecast parts deformation during the reflow process when manufacturing connector parts made of liquid crystal polymer (LCP). These LCP connectors are finding growing use in mobile devices such as smartphones and switches, along with automotive-related applications.
LCP parts can expand considerably in the high-temperature conditions of the reflow process which can have an adverse effect on the flatness of a final product. Since heat deformation can cause poor bonding as a result of insufficient soldering to the metal terminals, it is important to find ways to reduce heat deformation, particularly as the market sees growing demand for smaller connectors. In response, Polyplastics looked to CAE and began considering design-stage deformation forecasting for molded articles in the reflow process.
LCP parts can expand considerably in the high-temperature conditions of the reflow process which can have an adverse effect on the flatness of a final product. Since heat deformation can cause poor bonding as a result of insufficient soldering to the metal terminals, it is important to find ways to reduce heat deformation, particularly as the market sees growing demand for smaller connectors. In response, Polyplastics looked to CAE and began considering design-stage deformation forecasting for molded articles in the reflow process.
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