Teledyne e2v introduces high resolution ToF sensor for next generation 3D vision systems

KUALA LUMPUR, July 30 -- Teledyne e2v, a Teledyne Technologies company and global innovator of imaging solutions, has unveiled its Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement.

Based on a statement, the sensor supports the latest industrial applications, including vision guided robotics, logistics and automated guided vehicles.

Hydra3D’s high resolution and flexible configuration, combined with its on-chip HDR, make it ideal for outdoor applications such as surveillance, ITS, building construction and drones.

The sensor features a 10 µm three-tap cutting-edge pixel, designed with Teledyne e2v’s proprietary CMOS technology and produced by Tower Semiconductor, the leader in high-value analog semiconductor foundry solutions.

Incorporating a resolution of 832 x 600 pixels, Hydra3D provides very fast transfer times starting from 20ns, excellent demodulation contrast and sensitivity.

The sensor can be operated in real-time at short, mid and long-range distances, in both indoor and outdoor conditions, while providing excellent temporal precision.

It comes with an evaluation kit (Hydra3D EK), enabling customers to evaluate the sensor in multiple application setups. The kit includes a compact 2/3-inch optical format calibrated module, which includes a light source for near infrared illumination and an optic.

Two versions will be available, targeted at performing the ToF principle at short-range distances (up to five metres) or mid-range distances (up to 10 metres) and with a field-of-view of 60° x 45° or a field of view of 40° x 30°, while capturing real-time 3D information at a full resolution.

Samples will be available in August while evaluation kits, in September.

-- BERNAMA