KUALA LUMPUR, May 31 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology has announced its new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras.
The cameras redefine performance and feature the latest On-Semiconductor and E2V sensors, offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price.
Perfectly complemented by the half-length Xtium-CXP frame grabber, these series have been designed to work synergistically, minimise CPU usage and improve processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.
The Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection and machine vision.
For more information, contact http://www.teledynedalsa.com.
-- BERNAMA
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