KUALA LUMPUR, March 26 (Bernama) -- World leader in memory solutions, Toshiba Memory Corporation has begun sampling new Automotive JEDEC UFS Version 2.1 embedded memory solutions, utilising 3D flash memory.
The new products are embedded flash memory devices that integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a single package.
The sequential read and write performances are improved by approximately six per cent and 33 per cent, respectively, over existing devices.
The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the enhanced reliability required by various automotive applications.
The line-up consists of four capacities - 32GB, 64GB, 128GB and 256GB.
The new UFS devices feature several functions well-suited to the requirements of automotive applications, including Refresh, Thermal Control and Extended Diagnosis.
Technology advances in automotive information and entertainment systems and ADAS-related products for the realisation of connected cars and autonomous vehicles will continue to push the storage demands in automotive applications ever higher.
As these demands continue to grow, Toshiba Memory Corporation will retain a leadership position in the market by reinforcing its line-up of high-performance, high-capacity memory solutions targeting the sector.
More details on the product on https://business.toshiba-memory.com/en-apac/top.html
-- BERNAMA
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