Toshiba unveils new 130nm FFSA development platform

KUALA LUMPUR, Nov 13 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) unveiled a new 130nm manufacturing process node based Fit Fast Structured Array (FFSA), manufactured by Japan Semiconductor -- a subsidiary of Toshiba.

FFSA is an innovative custom SoC development platform featuring high performance, low cost and low power consumption, a statement said.

Toshiba provides Application Specific IC (ASIC) and FFSA platforms that suit the customer's business environment and requirements. It also deliver efficient solutions for custom SoC development.

FFSA devices use a silicon-based master slice which is common in combination with upper metal layers that are reserved for customization. It enables significant reductions in development cost and provides samples and mass-production in a short period of time than for conventional ASIC’s.

The 130nm process series joins Toshiba’s current 28nm, 40nm and 65nm process portfolio, making FFSA a suitable option for the growing industrial equipment market. Manufacturer to ensure long-term supply and meet customer’s business continuity plans.

The new series deliver the performance and integration needed for industrial apparatus, communication facilities, OA equipment and consumer products where steady market expansion is expected.

Toshiba is among the leading general devices companies which offer customers and business partners outstanding solutions in discrete semiconductors, system LSIs and HDD. More details on https://toshiba.semicon-storage.com/ap-en/top.html.

-- BERNAMA